Трафарет для bga stih237

Refer to Air-Vac manual for further information. 5.0 Profile Saving Save the new Profile by clicking on the «Save» button in the upper left corner of the screen. Place the circuit board in an oven for 15 to 30 minutes at 160 — 175F to cure the Adhesive. Apply High Temperature Tape to divert hot air from BGA Rework Nozzle from flowing directly onto Thermocouple.

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